The Design and Manufacture of a Light Emitting Diode Package for General Lighting
نویسنده
چکیده
................................................................................................................................. IV ACKNOWLEDGEMENTS ........................................................................................................... V TABLE OF CONTENTS ............................................................................................................. VII LIST OF TABLES ......................................................................................................................... X LIST OF FIGURES ...................................................................................................................... XI CHAPTER 1: INTRODUCTION ................................................................................................... 1 1.1 Current Lighting Technologies ............................................................................................. 2 1.2 LEDs in Developing Countries ............................................................................................. 4 1.3 LED Challenges .................................................................................................................... 6 1.4 L-Prize................................................................................................................................... 8 1.5 Project Goals ......................................................................................................................... 9 CHAPTER 2: LITERATURE REVIEW ...................................................................................... 10 2.1 Electroluminescence – LED Light Generation ................................................................... 10 2.2 Common LED Package Types ............................................................................................ 12 2.3 Functions of Electronics Packaging .................................................................................... 14 2.3.1 Thermal Considerations............................................................................................... 14 2.3.2 Power and Signal Distribution .................................................................................... 27 2.3.3 Circuit Support and Protection .................................................................................... 28 2.4 LED Package Degradation and Reliability Studies ............................................................ 29
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